The past couple of weeks have been full of iPhone 6s leaks, and today we’ve got another to check out.
A report from 9to5Mac, source of other recent iPhone 6s leaks, claims to have more information on some of the internals of Apple’s next smartphone. Images of what’s said to be the iPhone 6s’s logic board show that Apple may be planning to substantially reduce the number of chips that it’s using, which could increase power efficiency for the ones that are included.
Focusing on one chip specifically, the iPhone 6s will reportedly include a new NFC module. The NXP 66VP2 will reportedly make the cut into the 6s, compared to the NXP 65V10 chip that’s in the iPhone 6 and was originally released in 2012. However, right now it’s unclear what benefits the newer NFC chip might offer.
Finally, the internals included in today’s leak is said to include a 16GB flash memory module. That suggests that Apple might once again offer 16GB as the base model iPhone, despite concerns that 16GB is too little an amount to include in a flagship smartphone in 2015.
When Apple announced iOS 9, it said that it was making OS install sizes smaller, which would make it easier for consumers with less capacious iPhones to install updates. That said, 16GB is still a pretty measly amount of storage for a high-end phone, especially one that a lot of consumers use as their primary camera. It’s possible that the model in today’s leak is only meant for testing and that Apple will include additional storage in its retail iPhone 6s, but we’ll have to wait until September-ish to be sure.
